What The EU Cyber Resilience Act Means For Digital Product Makers - What manufacturers need to know to comply with upcoming security regulations. The post What The EU Cyber Resilience Act Means For Digital Product Makers appeared first on Semiconductor Engineering .
Handheld enclosures add integrated cable glands - OKW now offers CONNECT fast-assembly handheld plastic enclosures with optional integrated cable glands, making it easier to install power and Continue Reading The post Handheld enclosures add integrated cable glands appeared first on EDN .
[Blog] Unlocking Edge Connectivity with FPGAs - Interest in edge computing has surged as organizations across industries seek smarter ways to automate processes, enhance productivity, and optimize labor. By processing data closer to its source, edge systems can provide benefits like reduced transmission and storage costs and strengthened security....
Samsung to command the AI inference market with GDDR7 - Samsung Electronics' latest-generation GDDR7 has received the 2025 Korea Technology Awards Presidential Award, and its importance is growing as Nvidia adopts the memory for AI inference GPUs.
Completion of Security Consolidation - Global semiconductor developer BluGlass Limited (ASX: BLG) has completed the consolidation of the Company’s issued capital of on the basis…
Verification and Reliability Methods For RRAM-Based Computing-in-Memory (Univ. of Bremen et al) - A new technical paper titled “Special Session Paper: Formal Verification Techniques and Reliability Methods for RRAM-based Computing-in-Memory” was published by researchers at University of Bremen, DFKI GmbH, University of Florida and TU Munich. Abstract “Computing-in-memory (CIM) has gained immense...
The Oura Ring 4: Does “one more” deliver much (if any) more? - Two consecutive smart ring generations may look the same from the outside. But delve under the surface and differences become more obvious. The post The Oura Ring 4: Does “one more” deliver much (if any) more? appeared first on EDN .
Meet the Power-Delivery Chiplets That May Save 50% of Your AI Power - If you’d tried to start a power-related conversation with me just a few short years ago, I’d probably have shrugged my shoulders in disinterest. These days, however, it seems the subject of power is on everybody’s lips. It’s a hot topic, if you’ll forgive the pun (and even if you won’t). I...
Kulicke & Soffa Declares Quarterly Dividend of $0.205 - Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company"), today announced that its Board of Directors has approved a quarterly dividend of $0.205 per share of...
Melexis Launches Free People Detection Algorithm for its FIR Array - Melexis presents a new privacy-friendly algorithm for people detection, counting and localization using the MLX90642 32x24 thermal array, offering a camera-free alternative for space-constrained environments.
Pasqal brings neutral atom QPUs to scaleway quantum cloud - Pasqal, a global leader in neutral-atom quantum computing, announced its integration into Scaleway’s QaaS platform, unveiled at ai-PULSE 2025. This collaboration makes Pasqal’s advanced quantum…
Chip Industry Week in Review - 3D printed chip packages; UMC-Polar deal; Marvell's photonics acquisition; US stake in EUV litho; global IC forecast raised; Micron exits consumer biz; Canada invests in IC packaging; new thin films site; GaN deal; chiplet challenges, benefits; FeFETs for low-power NAND flash. The post Chip Industry Week...
Heat Dissipation in Solid-State Nanopore (Univ. of Osaka et al) - A new technical paper titled “Gate-Tunable Ionothermoelectric Cooling in a Solid-State Nanopore” was published by researchers at the University of Osaka, the University of Tokyo, National Institute of Advanced Industrial Science and Technology et al. The paper states: “Efficient heat dissipation...
Sony Launches First 200MP Smartphone Sensor: LYTIA 901 - Sony debuts its first 200MP smartphone sensor, the LYTIA 901, featuring a 1/1.12-inch format, 0.7µm pixels, AI remosaicing, advanced HDR, and flagship zoom performance.
The Big Allis generator sixty years ago - The “Big Allis” generator made by Allis-Chalmers suffered a major design flaw that revealed itself during the 1965 Northeastern blackout. The post The Big Allis generator sixty years ago appeared first on EDN .
Design specification: The cornerstone of an ASIC collaboration - The customer and the ASIC developer must agree, in greater detail, on what they are trying to build. The post Design specification: The cornerstone of an ASIC collaboration appeared first on EDN .
Enterprise SSD Prices and Shipments Surge in 3Q25, Industry Revenue Climbs 28%, Says TrendForce - The enterprise SSD market experienced robust growth in the third quarter of 2025. TrendForce’s latest reports reveal that AI demand continued to expand from training to inference tasks. Meanwhile, North American CSPs simultaneously scaled out both AI infrastructure and general-purpose servers. This...
[News] Inside Huawei’s Patent Playbook: GPU Dominance and Sub-2nm Ambitions Under Sanctions - As China accelerates its push for semiconductor self-sufficiency, all eyes are on how leading tech firms are advancing cutting-edge technologies under U.S. sanctions, with Huawei clearly at the forefront. According to Nikkei, the Chinese chip giant has dramatically ramped up GPU-related patent filin......
How Regional Differences Are Shaping the Future of the RFID Market - The global RFID market continues to expand, with IDTechEx forecasting growth from US$15.6 billion in 2025 to US$23 billion by 2036. and associated software and services across both passive and active technologies. Drawing on insights from IDTechEx's latest research study, "RFID 2026-2036: Forecasts, Players...
The Die is Not Enough – How Maskless Lithography Enables the Next Generation in Advanced Packaging - As AI and HPC push monolithic circuits to obsolescence, the industry turns to Advanced Packaging. Yet, challenges like die shift and substrate warpage threaten to kill yield before the package leaves the fab. Enter the new hero of microelectronics: Maskless Lithography. Learn how adaptive alignment ensures...
Pushing the boundaries with sensing excellence: a deep dive with Jens Milnikel - This interview with Jens Milnikel, EVP & GM, CMOS Sensors ASICs (CSA) at ams OSRAM, reveals not just the technologies and strategies driving the CSA business of ams OSRAM, but the human stories, partnerships, and vision that set it apart as a true leader in the future of sensing solutions. Can you
