TEE.fail: When Your Security System Leaves the Window Open - Ensuring sensitive data is still protected when moving between CPU and memory. The post TEE.fail: When Your Security System Leaves the Window Open appeared first on Semiconductor Engineering .
The Oura Ring 4: Does “one more” deliver much (if any) more? - Two consecutive smart ring generations may look the same from the outside. But delve under the surface and differences become more obvious. The post The Oura Ring 4: Does “one more” deliver much (if any) more? appeared first on EDN .
[Blog] Unlocking Edge Connectivity with FPGAs - Interest in edge computing has surged as organizations across industries seek smarter ways to automate processes, enhance productivity, and optimize labor. By processing data closer to its source, edge systems can provide benefits like reduced transmission and storage costs and strengthened security....
Moore Threads soars fivefold on STAR Market debut as US$1.07bn fuels AI chip drive - Moore Threads, billed as China's first domestic GPU stock, debuted on 5 December with a near fivefold jump from its issue price, becoming the STAR Market's largest IPO in 2025. The company issued 70 million shares at CNY114.28 each, equal to 14.89% of total equity, and expects net proceeds of CNY7.576...
Completion of Security Consolidation - Global semiconductor developer BluGlass Limited (ASX: BLG) has completed the consolidation of the Company’s issued capital of on the basis…
Verification and Reliability Methods For RRAM-Based Computing-in-Memory (Univ. of Bremen et al) - A new technical paper titled “Special Session Paper: Formal Verification Techniques and Reliability Methods for RRAM-based Computing-in-Memory” was published by researchers at University of Bremen, DFKI GmbH, University of Florida and TU Munich. Abstract “Computing-in-memory (CIM) has gained immense...
Compact 1.25-kV MLCCs ensure stability - Murata has begun mass production of 1.25-kV multilayer ceramic capacitors with a capacitance of 15 nF in a 1210-size (3.2×2.5-mm) package. The post Compact 1.25-kV MLCCs ensure stability appeared first on EDN .
Solar Flares and the Threat to High-Tech - The reliability of high-tech, miniaturized technologies is something easily assumed, but could they be reaching their peak? The looming presence of recent solar flare activity impacting communications is a reminder of the large and ever-present phenomenon of outer space, and could mean preparing for the...
The Die is Not Enough – How Maskless Lithography Enables the Next Generation in Advanced Packaging - As AI and HPC push monolithic circuits to obsolescence, the industry turns to Advanced Packaging. Yet, challenges like die shift and substrate warpage threaten to kill yield before the package leaves the fab. Enter the new hero of microelectronics: Maskless Lithography. Learn how adaptive alignment ensures...
Pushing the boundaries with sensing excellence: a deep dive with Jens Milnikel - This interview with Jens Milnikel, EVP & GM, CMOS Sensors ASICs (CSA) at ams OSRAM, reveals not just the technologies and strategies driving the CSA business of ams OSRAM, but the human stories, partnerships, and vision that set it apart as a true leader in the future of sensing solutions. Can you
Pasqal brings neutral atom QPUs to scaleway quantum cloud - Pasqal, a global leader in neutral-atom quantum computing, announced its integration into Scaleway’s QaaS platform, unveiled at ai-PULSE 2025. This collaboration makes Pasqal’s advanced quantum…
Chip Industry Week in Review - 3D printed chip packages; UMC-Polar deal; Marvell's photonics acquisition; US stake in EUV litho; global IC forecast raised; Micron exits consumer biz; Canada invests in IC packaging; new thin films site; GaN deal; chiplet challenges, benefits; FeFETs for low-power NAND flash. The post Chip Industry Week...
Heat Dissipation in Solid-State Nanopore (Univ. of Osaka et al) - A new technical paper titled “Gate-Tunable Ionothermoelectric Cooling in a Solid-State Nanopore” was published by researchers at the University of Osaka, the University of Tokyo, National Institute of Advanced Industrial Science and Technology et al. The paper states: “Efficient heat dissipation...
Sony Launches First 200MP Smartphone Sensor: LYTIA 901 - Sony debuts its first 200MP smartphone sensor, the LYTIA 901, featuring a 1/1.12-inch format, 0.7µm pixels, AI remosaicing, advanced HDR, and flagship zoom performance.
The Big Allis generator sixty years ago - The “Big Allis” generator made by Allis-Chalmers suffered a major design flaw that revealed itself during the 1965 Northeastern blackout. The post The Big Allis generator sixty years ago appeared first on EDN .
Design specification: The cornerstone of an ASIC collaboration - The customer and the ASIC developer must agree, in greater detail, on what they are trying to build. The post Design specification: The cornerstone of an ASIC collaboration appeared first on EDN .
Enterprise SSD Prices and Shipments Surge in 3Q25, Industry Revenue Climbs 28%, Says TrendForce - The enterprise SSD market experienced robust growth in the third quarter of 2025. TrendForce’s latest reports reveal that AI demand continued to expand from training to inference tasks. Meanwhile, North American CSPs simultaneously scaled out both AI infrastructure and general-purpose servers. This...
[Exclusive] Memory Crunch Hits PCs: Dell Hikes Prices 15-20% Mid-December, Lenovo from January 2026 - Soaring AI-server memory demand is driving DRAM prices sharply higher—and now PC and notebook makers are feeling the squeeze. Industry sources revealed today that Lenovo has begun notifying clients of coming price hikes, with adjustments set to take effect in early 2026 as market pressures mount. ......
Meet the Power-Delivery Chiplets That May Save 50% of Your AI Power - If you’d tried to start a power-related conversation with me just a few short years ago, I’d probably have shrugged my shoulders in disinterest. These days, however, it seems the subject of power is on everybody’s lips. It’s a hot topic, if you’ll forgive the pun (and even if you won’t). I...
Kulicke & Soffa Declares Quarterly Dividend of $0.205 - Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company"), today announced that its Board of Directors has approved a quarterly dividend of $0.205 per share of...
Melexis Launches Free People Detection Algorithm for its FIR Array - Melexis presents a new privacy-friendly algorithm for people detection, counting and localization using the MLX90642 32x24 thermal array, offering a camera-free alternative for space-constrained environments.
