TOPPANとファンケル、早稲田実業学校高等部の吹奏楽部員に体表温を色で見える化する「示温シール」を試験提供  - 味の素（株）が主催する「アクアソリタ®『応援熱中症』対策プロジェクト」の一環として実施暑熱リスクへの気づきを支援

 Ennostar Qualifies Veeco’s New LUMINA®+ MOCVD System for Advanced Product Applications

 Design for AI and AI for Design  - The semiconductor industry is experiencing a once-in-a-generation transformation…

 Announcement on Organization Changes and Personnel Changes

 FY2026 1st Quarter Financial Results is planned to be announced on July 29 (15:30 JST)

 XBC300 Gen2 SP: Surface Preparation for Advanced Hybrid Bonding

 Jack Technology collaborates with Siemens to advance intelligent apparel manufacturing with Industrial AI and humanoid robotics

 Increasing Passenger Safety with Crash Dummy Test Simulations  - The development of automotive safety has come a long way, from the rudimentary use…

 SPM Wafer Cleaning for Advanced Semiconductor Manufacturing  - Wafer cleaning is one of the most critical steps in the semiconductor process flow, especially as dimensions continue to shrink to below the 1-nanometer (nm) node. Photoresist residue and particulates can reduce yields in large-die AI chips, impacting the performance of the final product or causing the...